Removable drop-through die bond frame

Details Removable drop-through die bond frame Removable drop-through die bond frame

1991-07-25

1992-04-07

Gorski, Joseph M.

Metal working

Means to assemble or disassemble

Means to assemble electrical device

29758, 29759, B23P 1904

Patent

active

051015501

ABSTRACT:
A method and apparatus for accurately positioning a semiconductor chip onto a die bond pad region of a semiconductor package. A frame is constructed for slidable contact with peripheral walls of a semiconductor package die cavity. A frame central aperture with a wide upper opening and a narrower lower opening guides a semiconductor chip dropped therethrough into a precise position in the die cavity.

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IBM Technical Disclosure Bulletin, vol. 28, No. 5, pp. 2237-2238, Oct. 1985.

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