Removable cooling duct with interlocking dovetail...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S679460, C361S690000, C165S080300, C454S184000

Reexamination Certificate

active

07660111

ABSTRACT:
A method and incorporated assembly is provided for cooling of an electronic device or component. The assembly comprises a thermal duct having a fixed duct portion and a removable duct portion. The portions each have complementary interlocking components to secure them to one another. Also a first attachment block is provided. The first attachment block has complementary interlocking portions with the fixed and removable duct portions such that the block can be secured at least partially to each of the fixed duct portion and the removable duct portion. A second attachment block is also provided that has a complementary interlocking portion with the removable duct portion. This second attachment block can be secured to one or more electronic devices requiring cooling.

REFERENCES:
patent: 6464578 (2002-10-01), Chin et al.
patent: 6570760 (2003-05-01), Wang
patent: 6587335 (2003-07-01), Nelson et al.
patent: 6785145 (2004-08-01), Wong
patent: 6871879 (2005-03-01), Gan
patent: 6930882 (2005-08-01), Broder et al.
patent: 6971749 (2005-12-01), Russell et al.
patent: 7023696 (2006-04-01), Ko
patent: 7050300 (2006-05-01), Hein
patent: 7068505 (2006-06-01), Kosugi
patent: 7457114 (2008-11-01), Peng et al.
patent: 2002/0134531 (2002-09-01), Yanagida
patent: 2004/0095723 (2004-05-01), Tsai et al.
patent: 2004/0240175 (2004-12-01), Brovald et al.

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