Remote plasma enhanced CVD method and apparatus for growing an e

Details Remote plasma enhanced CVD method and apparatus for growing an e Remote plasma enhanced CVD method and apparatus for growing an e

1990-10-29

1993-01-19

Bueker, Richard

Coating apparatus

Gas or vapor deposition

With treating means

118722, 118724, 156610, 156612, 427562, 427563, 427569, C23C 1648

Patent

active

051804352

ABSTRACT:
A remote plasma enhanced CVD apparatus and method for growing semiconductor layers on a substrate, wherein a intermediate feed gas, which does not itself contain constituent elements to be deposited, is first activated in an activation region to produce plural reactive species of the feed gas. These reactive species are then spatially filtered to remove selected of the reactive species, leaving only other, typically metastable, species which are then mixed with a carrier gas including constituent elements to be deposited on the substrate. During this mixing, the selected spatially filtered reactive species of the feed gas chemically interacts, i.e., partially dissociates and activates, in the gas phase, the carrier gas, with the process variables being selected so that there is no back-diffusion of gases or reactive species into the feed gas activation region. The dissociated and activated carrier gas along with the surviving reactive species of the feed gas then flows to the substrate. At the substrate, the surviving reactive species of the feed gas further dissociate the carrier gas and order the activated carrier gas species on the substrate whereby the desired epitaxial semiconductor layer is grown on the substrate.

REFERENCES:
patent: 4051382 (1977-09-01), Ogawa
patent: 4438368 (1984-03-01), Abe
patent: 4440108 (1984-04-01), Little
patent: 4450031 (1984-05-01), Ono
patent: 4450787 (1984-05-01), Weakliem
patent: 4718976 (1988-01-01), Fujimura
patent: 5018479 (1991-05-01), Markunas

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