Remelting process for printed circuit boards

Details Remelting process for printed circuit boards Remelting process for printed circuit boards

1989-02-24

1992-12-29

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

228 51, 228 20, H05K 334

Patent

active

051740206

ABSTRACT:
The appearance of stresses when remelting printed circuit boards should be avoided. The remelting process of the tin-lead layers ensues in a pressure vessel at elevated ambient gas pressure. The quantity of heat required for the remaining can be supplied on the basis of known methods (infrared irradiation, oil, etc.) or by heating the compressed gas itself. As needed, the compressed gas can be designed as a protective atmosphere. Printed circuit boards of any and all types can be remelted by this process.

REFERENCES:
patent: 3548062, Smith, Jr.
patent: 4022370 (1977-05-01), Durney
patent: 4373658 (1983-02-01), March et al.
patent: 4538757 (1985-09-01), Bertiger
patent: 4580716 (1986-04-01), Barresi et al.
patent: 4626205 (1986-12-01), Barkley et al.
patent: 4726506 (1988-02-01), Kondo
patent: 4817851 (1989-04-01), Kolesaret et al.
AT&T Technical Digest No. 75 Sep. 1989 by C. Colderwood p. 11.

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