Reliable superconducting link for superconducting thin film comp

Superconductor technology: apparatus – material – process – High temperature – per se – Having tc greater than or equal to 150 k

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357 67, 357 70, 357 85, 357 69, 505703, 505704, 505813, 505927, 505 1, H01L 2348, H01L 2944, H01L 4900, H01B 1200

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051482622

ABSTRACT:
A reliable superconducting contact for superconducting thin film components, based on soft superconducting materials, and a method for making the contacts. A wire blank is squeezed to a thin plate and then this plate is cut into slabs used in the bonding. The ends of the slabs are longitudinally cut so that double or multiple parallel joints can be made. The slabs have elastic, bent central portions for absorbing stresses and stiff ends having a U-beam shape joined to the components. The U-beam shape may be formed by the soldering tool used to make the joints. The ribbon-like character, thinness and other features of the bonding slab permit a precise control of the bonding temperature, reduce the strain and bending forces caused by thermal contraction, and prevent the contact from peeling off while cooling the superconducting component to the operational temperature.

REFERENCES:
patent: 3855693 (1974-12-01), Umbaugh
patent: 4660061 (1987-04-01), Sweeny et al.
patent: 4963523 (1990-10-01), Ekin et al.
S. Williamson, M. Hoke, G. Stroink, M. Kotani, Advances in Magnetism, 1989, pp. 653-656.

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