Measuring and testing – Specimen stress or strain – or testing by stress or strain... – Deformation or change in stress after fracture – cutting – or...
Patent
1987-05-18
1989-04-25
Myracle, Jerry W.
Measuring and testing
Specimen stress or strain, or testing by stress or strain...
Deformation or change in stress after fracture, cutting, or...
G01N 1906
Patent
active
048236071
ABSTRACT:
Released film structures are employed in measuring the mechanical properties of the film material. By measuring the deformation of thin film structures held under intrinsic tensile stress and then released, these mechanical properties can be accurately measured.
REFERENCES:
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"Novel Microstructures for the Study of Residual Stress in Polyimide Films," M. Mehregany, R. T. Howe, and S. D. Senturia in the Proceedings of the Electronic Materials Conference, Amherst, MA, 6/86, pp. 179-180.
"Novel Microstructures for the Study of Residual Stress in Polyimide Films," Mehregany, Howe, Senturia, in the Proceedings of the MIT VLSI Research Review, Cambridge, MA, May 19, 1986.
Howe Roger T.
Mehregany Mehran
Senturia Stephen D.
Massachusetts Institute of Technology
Myracle Jerry W.
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