Release sheet for printed circuit board manufacture

Details Release sheet for printed circuit board manufacture Release sheet for printed circuit board manufacture

1990-06-14

1991-08-27

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156289, 524606, 528335, B32B 3100

Patent

active

050430416

ABSTRACT:
A process and nylon release sheet for manufacturing printed circuit boards from epoxy prepregs is disclosed. In such process layers of the prepregs are separated from one another by a release sheet. The release sheet comprises an aliphatic or aromatic nylon or nylon copolymer which is a condensation product of a dicarboxylic acid and a diamine. The nylon film contains a heat stabilizer and an inorganic particulate antiblock additive, e.g. diatomaceous earth, glass beads, amorphous silica, talc, mica and molybdenum disulphide. The nylon may be toughened by the addition of a phosphorus-containing catalyst or an epoxide.

REFERENCES:
patent: 2705227 (1955-03-01), Stamatoff
patent: 4399556 (1982-07-01), Baer
patent: 4730016 (1988-03-01), Fujii et al.
patent: 4786678 (1988-11-01), Dobreski et al.
patent: 4810745 (1989-03-01), Pike et al.
Derwent 79-02956B/02 (JAP. 53-136084 11/28/78).
Derwent 80-33584C/19 (JAP 55-042839 3/26/80).

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