Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate
2004-04-15
2010-12-14
Zimmer, Marc S (Department: 1796)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
C427S096100, C428S521000, C428S522000
Reexamination Certificate
active
07851271
ABSTRACT:
The present invention relates to a mold releasing film for printed circuit board production, which comprises a resin layer (P) containing (A) a polyphenylene ether-based resin in an amount of 50 wt % or more. According to the present invention, it is possible to provide a mold releasing film suitable for production of printed circuit boards, particularly flexible printed circuit boards, which is excellent in mold-releasing property, exhibits little heat shrinkage, hardly imparts wrinkles to printed circuit board products, itself hardly gets wrinkled, and is excellent in contamination resistance since no bleeding-out is observed, and which is also excellent in an anti-moisture absorbing property, shape-following property, less overflow of adhesive, adhesion between multilayer films and slipping property between films.
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Machine-generated translation of JP 2002-248714.
Supplementary European Search Report, mailed Feb. 21, 2008 and issued in corresponding European Patent Application No. 04727714.0-1214.
Office Action issued Dec. 4, 2008 in corresponding European Patent Application No. 04 727 714.0. (in English).
Kamo Hiroshi
Kusumi Yuuji
Asahi Kasei Chemicals Corporation
Staas & Halsey , LLP
Zimmer Marc S
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