Releasable mounting and method of placing an oriented array of d

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156299, 156344, B32B 3102, B32B 3114

Patent

active

039922367

ABSTRACT:
An oriented array of small, fragile electrical devices such as beam lead transistors or integrated circuits, partially embedded in wax, are removed from the wax and transferred to a releasable mounting without disrupting the orientation of the devices. The releasable mounting comprises a plate with a layer of silicone rubber or resin which exerts a suction or vacuum holding force on the array of oriented devices.

REFERENCES:
patent: 2739829 (1956-03-01), Pedlow et al.
patent: 3276929 (1966-10-01), Ferch

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