Relay device and relay device mounting structure

Electricity: electrical systems and devices – Control circuits for electromagnetic devices – For relays or solenoids

Reexamination Certificate

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Reexamination Certificate

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06924964

ABSTRACT:
Terminals (11, 13) for electrical connection respectively have front end portions (11b,13b) to be joined to a wiring board (20) with solder and base end portions (11a,13a) drawn outside from a cover (7) made of heat-expanding material. In order for the base end portions to absorb stress countering the external force received from the cover subjected to thermal expansion due to the heat generated by an electromagnetic coil (5) by the deflection deformation of the intermediate portions (11c,13c) of the terminals positioned closer to the cover than the wiring board20with the relay device mounted on the wiring board, the terminals are formed with a predetermined length of L′ in the extending direction of the terminals so that the length required for necessary flexibility is secured for the intermediate portions.

REFERENCES:
patent: 4074342 (1978-02-01), Honn et al.
patent: 4814944 (1989-03-01), Sagawa et al.
patent: 5567984 (1996-10-01), Zalesinski et al.
patent: 5730932 (1998-03-01), Sarkhel et al.
patent: 6555052 (2003-04-01), Soga et al.
patent: 6765805 (2004-07-01), Naruse et al.
patent: 6774490 (2004-08-01), Soga et al.
patent: 0 917 196 (1999-05-01), None
Japanese Abstract No. 10289641, dated Oct. 27, 1998.
Japanese Abstract No. 06052911, dated Feb. 25, 1994.
Japanese Abstract No. 10056250, dated Feb. 24, 1998.

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