Related to the manufacture of lead frames and the mounting of se

Details Related to the manufacture of lead frames and the mounting of se Related to the manufacture of lead frames and the mounting of se

1974-04-03

1976-03-09

Tupman, W.

Metal working

Method of mechanical manufacture

Electrical device making

29626, B01J 1700

Patent

active

039422453

ABSTRACT:
A support for a semiconductor device comprises a lead frame having a matrix of cranked conductors, which may be on an insulating substrate, with a recess being defined within the lead frame, the arrangement being such that by merely placing a correctly oriented device in the recess, and providing the required electrical interconnections between the device and the conductors, the device is accurately located in its required position on the lead frame.

REFERENCES:
patent: 3316458 (1967-04-01), Jenny
patent: 3374537 (1968-03-01), Doelp
patent: 3544857 (1970-12-01), Byrne
patent: 3559285 (1971-02-01), Kauffman
patent: 3766638 (1973-10-01), Moore
IBM Technical Disclosure Bulletin, Sept. 1969, p. 538, "Single Chip Carrier Package," by Carroll.

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