Reject chip marking device and method of discriminating reject m

Details Reject chip marking device and method of discriminating reject m Reject chip marking device and method of discriminating reject m

1985-10-18

1988-10-25

Laroche, Eugene R.

Optics: measuring and testing

Inspection of flaws or impurities

Having predetermined light transmission regions

324158F, 324158P, G01R 3102

Patent

active

047799811

ABSTRACT:
Each of the chips in a wafer is provided with a specific zone which is used exclusively for recording a mark representative of the result of the inspection of the chip, that is, whether or not the chip is to be rejected. The specific zone is located at a constant position in the individual chips. By checking a specific zone which is located at the same position irrespective of the individual chips, the discrimination is made whether or not the chip is to be rejected. The zone includes a pad which is separate from bonding pads used for inspection. The probe card used with those chips is provided with a marking element mounted in stationary position but is movable to mark the marking pad. The marking is effected by pressing the marking element on the marking pad so as to form an indentation. During the probing operation, the marking element is actuated in response to the prober discriminating that the chip is to be rejected, so that the marking pad associated with the rejected chip is indented.

REFERENCES:
patent: 3345567 (1967-10-01), Turner et al.
patent: 3437929 (1969-04-01), Glenn
patent: 3641972 (1972-02-01), Hostetter
patent: 4568879 (1986-02-01), Nakamura et al.

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