Reinforcement for flexible printed circuit board and reinforced

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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361749, 174255, H05K 102

Patent

active

055833209

ABSTRACT:
A reinforcement for a flexible printed circuit board, which can sufficiently prevent the flexible printed circuit board thus reinforced from being warped when heated during the assembly process of electronic components or other procedures. The reinforcement according to the present invention is used to adhere to a flexible printed circuit board 1. The reinforcement according to the present invention comprises an internal material 21 having a bending neutral surface at the center of the thickness thereof, and an external material 22 having the same Young's modulus as that of an insulating substrate 11 of the flexible printed circuit board 1, bonded to one side of the internal material 21. The other side of the internal material 21 acts as an adhesive surface to the flexible printed circuit board 1.

REFERENCES:
patent: 5095628 (1992-03-01), Mckenney et al.
patent: 5262594 (1993-11-01), Edwin et al.
patent: 5426568 (1995-06-01), Lamers et al.
patent: 5450286 (1995-09-01), Jaques et al.
patent: 5468917 (1995-11-01), Brodsky et al.
patent: 5493074 (1996-02-01), Murata et al.

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