Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Noninterengaged fiber-containing paper-free web or sheet...
Reexamination Certificate
2007-11-27
2007-11-27
Edwards, N. (Department: 1774)
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Noninterengaged fiber-containing paper-free web or sheet...
C428S295100, C052S749100
Reexamination Certificate
active
10912350
ABSTRACT:
A reinforced polymer matrix composite material with anti-anisotropy reinforcement array is disclosed having coupled fiber reinforcement structures. The coupled fiber reinforcement structures are formed of a plurality of bound or bonded fibers, which form multi-dimensional structures capable of maintaining cross structure during molding. The structures are sized to allow their use in various molding processes. The coupled multiple fiber structures preferably have an aspect ratio of less than ten.
REFERENCES:
patent: 3846085 (1974-11-01), Dunn, Jr.
patent: 3920879 (1975-11-01), Segal et al.
patent: 4257835 (1981-03-01), Bompard
patent: 4477522 (1984-10-01), Sheehan
patent: 4515854 (1985-05-01), Kogame et al.
patent: 4600631 (1986-07-01), Alei et al.
patent: 4766028 (1988-08-01), Rich
patent: 4820574 (1989-04-01), Tesch
patent: 4911980 (1990-03-01), Tesch
patent: 5002814 (1991-03-01), Knack et al.
patent: 5127783 (1992-07-01), Moghe et al.
patent: 5266393 (1993-11-01), Grajewski
patent: 5419949 (1995-05-01), Marx et al.
patent: 5538781 (1996-07-01), Rao et al.
patent: 5587239 (1996-12-01), Ueba et al.
patent: 5806901 (1998-09-01), Tennyson et al.
patent: 5851665 (1998-12-01), Marcus
patent: 5888609 (1999-03-01), Karttunen et al.
patent: 5914163 (1999-06-01), Browne
patent: 5915775 (1999-06-01), Martin et al.
patent: 5945356 (1999-08-01), Pott
patent: 6056349 (2000-05-01), Seksaria et al.
patent: 6062632 (2000-05-01), Brachos et al.
patent: 6071834 (2000-06-01), Martz
Chapman, II Gilbert B
Moore Thomas S
Chrysler LLC
Edwards N.
Smith Ralph E.
LandOfFree
Reinforcement array for high modulus reinforcement of... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Reinforcement array for high modulus reinforcement of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reinforcement array for high modulus reinforcement of... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3828275