Reinforced wrap around ground and method

Details Reinforced wrap around ground and method Reinforced wrap around ground and method

1992-12-14

1994-08-23

Pascal, Robert J.

Wave transmission lines and networks

Long line elements and components

Strip type

333238, 29854, 29875, 29880, H01D 308

Patent

active

053411153

ABSTRACT:
A reinforced wrap around ground and method includes a substrate, including opposite first and second substrate surfaces separated by a substrate edge. A first metalization layer is coupled to the first substrate surface and a second metalization layer comprising an electrical ground, is coupled to the second substrate surface. An electrical ground reinforcement is coupled between the first metalization layer and the second metalization layer around the substrate edge. Conductive paste coats the electrical ground reinforcement, and the conductive paste is fired to bind the wrap around ground to the substrate and to electrically ground the first metalization layer to the second metalization layer through the electrical ground reinforcement and the conductive coating.

REFERENCES:
patent: 3885847 (1975-05-01), Thibeault
patent: 4529836 (1985-07-01), Powers et al.
patent: 4610032 (1986-09-01), Miller et al.
patent: 4642592 (1987-02-01), Beeck
patent: 4670723 (1987-06-01), Roland et al.

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