Reinforced transcalent device

Details Reinforced transcalent device Reinforced transcalent device

1975-11-12

1976-08-31

James, Andrew J.

Heat exchange

With valve or movable deflector for heat exchange fluid flow

With by-pass of heat exchanger or heat exchanger section

357 74, 357 79, 357 81, 165 80, 165105, 174 16B, 174 16HS, H01L 2302, H01L 2312, H01L 2342, H01L 2504

Patent

active

039785181

ABSTRACT:
A semiconductor wafer is sandwiched between the ends of two heat pipes. One end of each heat pipe is in electrical and thermal contact with the wafer. The heat pipes are fastened together so that the wafer is held in compression between the two heat pipes. The ends of the heat pipe, are reinforced from within the heat pipe so that the ends will not buckle due to the compression loading of the wafer.

REFERENCES:
patent: 3739235 (1973-06-01), Kessler
patent: 3792318 (1974-02-01), Fries et al.
patent: 3852803 (1974-12-01), Walmet et al.
Transcalent Silicon Power Rectifier; by Kessler; IEEE Transactions on Aerospace and Electronic Systems, vol. AES 7, No. 6, Nov. 1971.

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