Reinforced polyphenylene sulfide molded board, printed circuit b

Details Reinforced polyphenylene sulfide molded board, printed circuit b Reinforced polyphenylene sulfide molded board, printed circuit b

1982-06-07

1983-06-21

Bell, James J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

156242, 156243, 156245, 156283, 1563066, 428253, 428281, 428282, 428283, 428284, 428285, 428286, 428288, 428297, 428402, 428901, 264257, 264258, 428298, B32B 516

Patent

active

043894534

ABSTRACT:
A polyphenylene sulfide (PPS) molded board reinforced with 15-85 wt. % of glass fibers (GF) having a length of at least 5 mm is provided. The molded board is useful as an insulating substrate of a printed circuit board. The printed circuit board is prepared by compressing under heating a mixture or laminate of PPS and GF to form a composite molded board and, at or after the compression step, bonding a metallic foil to a surface the composite molded board. The printed circuit board is excellent in mechanical properties such as impact resistance, thermal properties such as heat distortion temperature and solder resistance, and adhesion between the insulating substrate and the metallic foil.

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