Reinforced poly(arylene ether)/polyamide composition

Compositions – Electrically conductive or emissive compositions

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C524S504000, C524S505000, C524S508000, C524S514000, C525S066000, C525S09200D, C525S391000, C525S397000

Reexamination Certificate

active

10910666

ABSTRACT:
A composition comprises greater than or equal to 20 weight percent glass fiber, based on the total weight of the composition, and a compatibilized blend of a poly(arylene ether) and an aliphatic-aromatic polyamide. The polyamide is composed of dicarboxylic acid units comprising 60 to 100 mol % of terephthalic acid units and diamine units comprising 60 to 100 mol % of 1,9-nonanediamine units and/or 2-methyl-1,8-octanediamine units. The polyamide has an amine end group content greater than 45 micromoles per gram of polyamide. The composition has a heat distortion temperature (HDT) greater than or equal to 230° C. when measured according to ASTM D 648 at 1.8 megapascals (MPa).

REFERENCES:
patent: 4315086 (1982-02-01), Uenon et al.
patent: 4600741 (1986-07-01), Aycock et al.
patent: 4659760 (1987-04-01), Van der Meer
patent: 4732938 (1988-03-01), Grant et al.
patent: 4745157 (1988-05-01), Yates, III et al.
patent: 4772664 (1988-09-01), Sumio et al.
patent: 4798865 (1989-01-01), Grant et al.
patent: 4808671 (1989-02-01), Sivavec
patent: 4826933 (1989-05-01), Grant et al.
patent: 4859739 (1989-08-01), Yates, III et al.
patent: 4863966 (1989-09-01), Black et al.
patent: 4863996 (1989-09-01), Nakazima et al.
patent: 4873276 (1989-10-01), Fujii et al.
patent: 4873286 (1989-10-01), Gallucci et al.
patent: 4874810 (1989-10-01), Lee, Jr. et al.
patent: 4923924 (1990-05-01), Grant et al.
patent: 4929675 (1990-05-01), Abe et al.
patent: 4957966 (1990-09-01), Nishio et al.
patent: 4960825 (1990-10-01), Van der Meer
patent: 4963620 (1990-10-01), Grant et al.
patent: 4994525 (1991-02-01), Brown et al.
patent: 4997612 (1991-03-01), Gianchandai et al.
patent: 5000897 (1991-03-01), Chambers
patent: 5059646 (1991-10-01), Morioka et al.
patent: 5086105 (1992-02-01), Abe et al.
patent: 5104937 (1992-04-01), Saito et al.
patent: 5104939 (1992-04-01), Van der Meer et al.
patent: 5109052 (1992-04-01), Kasai et al.
patent: 5109065 (1992-04-01), Saito et al.
patent: 5122576 (1992-06-01), White et al.
patent: 5132365 (1992-07-01), Gallucci
patent: 5134196 (1992-07-01), Van der Meer
patent: 5135983 (1992-08-01), Morioka
patent: 5162433 (1992-11-01), Nishio et al.
patent: 5237002 (1993-08-01), Nishio et al.
patent: 5248728 (1993-09-01), Lee, Jr.
patent: 5260359 (1993-11-01), Muehlbach et al.
patent: 5260374 (1993-11-01), Gallucci
patent: 5288786 (1994-02-01), Nishio et al.
patent: 5296533 (1994-03-01), Nagaoka et al.
patent: 5304593 (1994-04-01), Nishio et al.
patent: 5310821 (1994-05-01), Kodaira et al.
patent: 5324782 (1994-06-01), Lee, Jr.
patent: 5334636 (1994-08-01), Fujii et al.
patent: 5397838 (1995-03-01), Ohtomo et al.
patent: 5403888 (1995-04-01), Nishio et al.
patent: 5405902 (1995-04-01), Nishio et al.
patent: 5470902 (1995-11-01), Kubo et al.
patent: 5470913 (1995-11-01), Van der Meer et al.
patent: 5475049 (1995-12-01), Ohtomo et al.
patent: 5506305 (1996-04-01), Nagaoka et al.
patent: 5521244 (1996-05-01), Yates et al.
patent: 5554693 (1996-09-01), Ohtomo et al.
patent: 5719233 (1998-02-01), Gallucci et al.
patent: 5723539 (1998-03-01), Gallucci et al.
patent: 5741846 (1998-04-01), Lohmeijer et al.
patent: 5760125 (1998-06-01), Ohtomo et al.
patent: 5859130 (1999-01-01), Gianchandai, et al.
patent: 5859176 (1999-01-01), Nakahashi et al.
patent: 5863974 (1999-01-01), Tjahjadi et al.
patent: 5916970 (1999-06-01), Lee, Jr. et al.
patent: 5977240 (1999-11-01), Lohmeijer et al.
patent: 6171523 (2001-01-01), Silvi et al.
patent: 6180716 (2001-01-01), Majumdar
patent: 6319986 (2001-11-01), Amimoto et al.
patent: 6362263 (2002-03-01), Brown et al.
patent: 2003/0023008 (2003-01-01), Uchida et al.
patent: 2003/0088027 (2003-05-01), Chin et al.
patent: 2004/0034152 (2004-02-01), Oka et al.
patent: 0924261 (1999-06-01), None
patent: 1 024 171 (2000-01-01), None
patent: 1170335 (2001-07-01), None
patent: 1375578 (2003-06-01), None
patent: JP405339496 (1993-12-01), None
JP2004-083792. Application Date 2004-083792 (Machine Translation).
JP2000-212433. Publication Date: Aug. 2, 2000 (Machine Translation).
JP2000-212434. Publication Date: Aug. 2, 2000 (Machine Translation).
JP2003 041117. Feb. 13, 2003 Abstract Only.
ASTM D 570-98 “Standard Test Method for Water Absorption of Plastics”. p. 1-4.
ASTM D 256-04 “Standard Test Methods for Determining the Izod Pendulum Impact Resistance of Plastics”. pp. 1-20.
ASTM D 3763-02 “Standard Test Method for High Speed Puncture Properties of Plastics Using Load and Displacement Sensors” pp. 1-10.
International Search Report mailed on Dec. 8, 2004.
UL84 “Test for Flammability of Plastic Materials for Parts in Devices and Appliances” Fifth Edition Dated Oct. 29, 1996.
ASTM D 648-01 “Standard Test Method for Deflection Temperature of Plastics Under Flexural Load in the Edgewise Position” pp. 1-12.
ASTM D 790-03 “Standard Test Methods for Flexural Properties of Unreinforced and Reinforced Plastics and Electrical Insulating Materials”. pp. 1-11.
ASTM D 638-03 “Standard Test Method for Tensile Properties of Plastics” pp. 1-15.
JP2004-083792. Publication Date Mar. 18, 2004. (Manual Translation).
JP1997087483A. Publication Date. Mar. 31, 1997 (Manual Translation).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Reinforced poly(arylene ether)/polyamide composition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Reinforced poly(arylene ether)/polyamide composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reinforced poly(arylene ether)/polyamide composition will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3737246

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.