Reinforced contact elements

Details Reinforced contact elements Reinforced contact elements

2008-06-09

2009-12-08

Paumen, Gary F. (Department: 2833)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

Distinct contact secured to panel circuit

C439S839000, C439S862000

Reexamination Certificate

active

07628620

ABSTRACT:
Embodiments of reinforced resilient elements and methods for fabricating same are provided herein. In one embodiment, a reinforced resilient element includes a resilient element configured to electrically probe an unpackaged semiconductor device to be tested, the resilient element having a first end and an opposing second end; and a reinforcement member having a first end affixed to the resilient element at the first end thereof or at a point disposed between the first and the second ends of the resilient element, an opposing second end disposed in a direction towards the second end of the resilient element, and a resilient portion disposed between the first and second ends, wherein the resilient portion is not affixed to the resilient element.

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patent: 7473126 (2009-01-01), Chen et al.
patent: 2003/0104731 (2003-06-01), Chang
Inoue, Tatsuo et al., “A novel probe-card for 8 inch full wafer contact using MLS,” Micronics Japan Co., Ltd., 2005 South West Test Workshop, Jun. 5-8, 2005. Document as found on web page: http://www.swtest.org/swtw—library/2005proc/PDF/S05—02—Inoue-megna.pdf.

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