Reinforced backplane for high density electrical contacts

Details Reinforced backplane for high density electrical contacts Reinforced backplane for high density electrical contacts

1974-12-23

1976-11-09

Smith, Jr., David

Geometrical instruments

317101DH, 339 17LC, 339198S, H02B 100

Patent

active

039913465

ABSTRACT:
In accordance with the present disclosure, the conventional metal backplane utilized for mounting and interconnecting electronic components is reinforced to increase its rigidity and permit its acceptance of a large number of closely spaced electrical contacts without excessive deformation when accepting the mating contacts. Such reinforcement is achieved in a manner which does not sacrifice the obstruction free area on the backplane required for terminal interconnection as might be performed by wire wrap techniques or a printed circuit backplane.

REFERENCES:
patent: 3086074 (1963-04-01), Just et al.
patent: 3136591 (1964-06-01), Just et al.
patent: 3166372 (1965-01-01), Just
patent: 3368117 (1968-02-01), Pond et al.

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