Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...
Patent
1986-06-23
1987-05-26
Godici, Nicholas P.
Metal fusion bonding
Process
With measuring, testing, indicating, inspecting, or...
228 11, 228 62, B23K 106
Patent
active
046678700
ABSTRACT:
A head (158) precisely registers an article (10) to a site for operations such as bonding. The article (10) may be an electronic chip (10) containing a plurality of sides (12-15) having top edges for engaging the head (158) and bottom edges for registering to a topside (95) of a pedestal (20). A body (161) has an upper portion adapted for support and a lower portion terminating in a downwardly presented, working face (159). Face 159 includes a cavity (166) formed by walls (167-170) having inwardly and upwardly directed surfaces (171-174) for engaging corresponding top edges of the chip (10). The chip (10) is at least partially disposed within the cavity (166) making it difficult for an operator to see, especially when a fixed microscope is required for viewing. A bore (175) communicates with the cavity (166) and may be connected to a vacuum source for drawing a chip (10) into the cavity and for removably engaging the same to the engaging surfaces (171-174). Preferably, the front wall (168), facing the operator, has recessed end portions (100 and 102). Such recesses (100 and 102) reveal, preferbly extending to corners, bottom edges of the engaged chip (10) sufficient for registering such edges and the chip (10) to the topside (95) of the pedestal (20).
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V. T. Ho et al., article entitled "Ultrasonic Bonding Tip," IBM Technical Disclosure Bulletin, vol. 10, No. 12, May 1968.
Avedissian Michael K.
Hertzog Earl D.
American Telephone and Telegraph Company
AT&T - Technologies, Inc.
Godici Nicholas P.
Koba Wendy W.
Reid G. M.
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