Refrigeration – Processes – Circulating external gas
Reexamination Certificate
2000-02-16
2001-10-16
Bennett, Henry (Department: 3744)
Refrigeration
Processes
Circulating external gas
C062S271000
Reexamination Certificate
active
06301907
ABSTRACT:
FIELD OF THE INVENTION
The invention relates to a method and apparatus for cooling electronic devices, such as semiconductor chips, during testing of the devices.
BACKGROUND OF THE INVENTION
To test their operability and resistance to a variety of conditions, semiconductor chips are typically subjected to a variety of tests. For example, the chips may be cooled to test their resistance to subfreezing temperatures. To carry out a test wherein a semiconductor chip is exposed to cold temperatures.
SUMMARY OF THE INVENTION
The present invention provides an air cooling system for utilization in semiconductor chip testing. The air cooling system includes a first desiccant dryer. A second dryer is connected in a series in a flow path with the first desiccant dryer. A first air cooling unit is connected in series in the flow path with the second desiccant dryer.
The present invention also provides a method for cooling and drying air. The method includes drying the air such that it comprises about 4.5 grains of moisture. The air is cooled to about 73° F. The air is further cooled and dried such that the air includes less than about 4.5 grains of moisture and is at a temperature of about −39° C. by passing the air over cooling fins cooled by a non-nitrogen based coolant.
Additionally, the present invention provides a method for cooling and drying air. The method includes transmitting air through a first desiccant dryer. The air is then transmitted through a second desiccant dryer connected in a series in a flow path with the first desiccant dryer. Next, the air is transmitted through a first air cooling unit connected in series in the flow path with the second desiccant dryer.
Furthermore, the present invention provides a method testing a semiconductor device. The method includes arranging the semiconductor device on a testing apparatus. Air is transmitted through the first desiccant dryer. The air is then transmitted through a second desiccant dryer connected in series in a flow path with the first desiccant dryer. Subsequently, the air is transmitted through a first air cooling unit connected in series in the flow path with the second desiccant dryer. Then, the air is directed to the testing device to cool the semiconductor device.
Still further, the present invention provides a method for testing a semiconductor device. The method includes arranging the semiconductor device on a testing apparatus. Air is dried such that includes about 4.5 grains of moisture. The air is cooled to about 73° F. The air is further cooled and dried such that the air includes less than about 4.5 grains of moisture and is at a temperature of about −39° C. by passing the air over cooling fins cooled by non-nitrogen based coolant. Then, the air is directed to at least one testing device to cool the semiconductor device.
Still other objects and advantages of the present invention will become readily apparent by those skilled in the art from the following detailed description, wherein it is shown and described only the preferred embodiments of the invention, simply by way of illustration of the best mode contemplated of carrying out the invention. As will be realized, the invention is capable of other and different embodiments, and its several details are capable of modifications in various obvious respects, without departing from the invention. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive.
REFERENCES:
patent: 2811223 (1957-10-01), Newton
patent: 5125241 (1992-06-01), Nakanishi et al.
patent: 5325676 (1994-07-01), Meckler
patent: 5542259 (1996-08-01), Worek et al.
patent: 5579647 (1996-12-01), Calton et al.
patent: 5649428 (1997-07-01), Calton et al.
patent: 5653115 (1997-08-01), Brickley et al.
patent: 5740018 (1998-04-01), Rumbut, Jr.
patent: 5758509 (1998-06-01), Maeda
patent: 5768897 (1998-06-01), Rainville et al.
Hile William Ross
McCollin Gerald E.
Bennett Henry
Connolly Bove & Lodge & Hutz LLP
Jones Melvin
Parameter Generation & Co.
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