Refrigeration device and a method for producing the same

Details Refrigeration device and a method for producing the same Refrigeration device and a method for producing the same

2006-05-16

2006-05-16

Walberg, Teresa J. (Department: 3753)

Heat exchange

Heat transmitter

C165S080200

Reexamination Certificate

active

07044212

ABSTRACT:
The cooling device, particularly for electronic components, such as microprocessors, consists of a substrate (1), which features a heat-inlet surface that is in thermal contact with an object (6) to be cooled and a heat-dissipation surface. The heat-dissipation surface has a defined structure, preferably in the form of continuous channels (2), and has a significantly larger surface area than the heat-inlet surface. At least the heat-inlet surface, but preferably also all or significant portions of the heat-dissipation surface are provided with a thin coating (3) made of heat-conductive material. Another improvement is obtained because the surface features a coating made of fine particles (21), e.g., made of metal or metal oxide, which further increases the surface area.

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