Alloys or metallic compositions – Aluminum base – Copper containing
Patent
1985-05-06
1988-01-26
James, Andrew J.
Alloys or metallic compositions
Aluminum base
Copper containing
357 71, 420578, 420429, H01L 2946, H01L 2940
Patent
active
047219912
ABSTRACT:
A semiconductor device having an electroconductive portion made of a multi-component alloy which may be represented by a formula:
REFERENCES:
patent: 3582324 (1971-06-01), Kunert et al.
patent: 3854940 (1974-12-01), Hoekje
patent: 4619695 (1986-10-01), Oikawa et al.
Metals Handbook, 9th Ed., vol. 2, 1979, American Society for Metals, Metals Park, Ohio.
54 J. Appln. Phys. (2), 937-43 (Feb. 1983), Ting et al.
IEEE Translations on Electron Devices, vol. ED-30, No. 11, 1480-1504 (Nov. 1983), Chow et al.
M. A. Nicolet et al., "Formation and Characterization of Transition-Metal Silicides," VLSI Electronics: Microstructure Science, vol. 6, 1983.
Silicides for VLSI Application, Title page and p. 30, Academic Press, 1983, Murarka, S. P.
Mikata Yuuichi
Ogino Masanobu
Ohtaki Reiji
Jackson Jerome
James Andrew J.
Kabushiki Kaisha Toshiba
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