Chemistry of carbon compounds – Miscellaneous organic carbon compounds
Patent
1979-06-28
1981-02-03
McCarthy, Helen M.
Chemistry of carbon compounds
Miscellaneous organic carbon compounds
106 41, 106 65, 106 69, 106 735, 106 44, 264 30, 264269, 260 292EP, 260 292TN, 260 292N, 260 296XA, 260 296R, 260 334PQ, 260 334UR, 260 4211, C04B 3514, C08L 104, C08L 3324, C08L 110
Patent
active
042487528
ABSTRACT:
A refractory moldable composition which, upon drying, sets up to refractory shapes which are strongly adherent to the molding surfaces and are essentially crack-free, contains about 45 to about 65% of a liquid vehicle, such as water; about 21 to about 26% ceramic fiber; about 7 to about 30% finely divided silica; and sufficient adhesion enhancing agent to impart from about 18 to about 50 grams per square centimeter adherence to steel. The molded composition adheres excellently to molding surfaces and dries to give an essentially crack-free refractory shape, useful as thermal insulation at temperatures up to 1300.degree. C. The composition may optionally include hollow plastic or ceramic spheres.
REFERENCES:
patent: 2765507 (1956-10-01), Wolf et al.
patent: 2817128 (1957-12-01), Wickett
patent: 2821514 (1958-01-01), Sarbach et al.
patent: 3025256 (1962-03-01), Janota et al.
patent: 3104230 (1963-09-01), Dewey et al.
patent: 3125404 (1964-03-01), Crawley
patent: 3262165 (1966-07-01), Ingham
patent: 3458329 (1969-07-01), Owens et al.
patent: 3460606 (1969-08-01), Boddey
patent: 3489714 (1970-01-01), Sayles
patent: 3835054 (1974-09-01), Olewinski et al.
patent: 3935060 (1976-01-01), Blome et al.
Bell Mark
Dougherty David E.
Dunn Michael L.
Green Raymond W.
McCarthy Helen M.
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