Refractory metal substrate with improved thermal conductivity

Details Refractory metal substrate with improved thermal conductivity Refractory metal substrate with improved thermal conductivity

2004-11-01

2008-08-26

Hendricks, Keith D. (Department: 1794)

Stock material or miscellaneous articles

All metal or with adjacent metals

Laterally noncoextensive components

C428S596000, C428S620000, C428S621000, C428S660000, C428S668000, C428S674000, C428S457000, C361S709000, C257S720000

Reexamination Certificate

active

07416789

ABSTRACT:
A substrate for semiconductor and integrated circuit components including:a core plate containing a Group VIB metal from the periodic table of the elements and/or an anisotropic material, having a first major surface and a second major surface and a plurality of openings extending, at least partially, from the first major surface to the second major surface; anda Group IB metal from the periodic table of the elements or other high thermally conductive material filling at least a portion of the space encompassed by at least some of the openings; andoptionally, a layer containing a Group IB metal from the periodic table or other high thermally conductive material disposed over at least a portion of the first major surface and at least a portion of the second major surface.The substrate can be used in electronic devices, which can also include one or more semiconductor components.

REFERENCES:
patent: 4996115 (1991-02-01), Eerkes et al.
patent: 5011655 (1991-04-01), Mankins
patent: 5156923 (1992-10-01), Jha et al.
patent: 5300809 (1994-04-01), Nakamura et al.
patent: 6045927 (2000-04-01), Nakanishi et al.
patent: 6555762 (2003-04-01), Appelt et al.
patent: 2002/0043364 (2002-04-01), Suzuki et al.
patent: 0 537 965 (1993-04-01), None
patent: 01/78109 (2001-10-01), None
Tokunaga (JP 09-045828 English Machine Translation) Feb. 1997.
Patent Abstracts of Japan vol. 1999, No. 07, Mar. 31, 1999 & JP 03 231445 A Inco Ltd), Oct. 15, 1991 abstract.
Patent Abstracts of Japan vol. 1997, No. 06, Jun. 30, 1997 & JP 09 045828 A Nec Corp), Feb. 14, 1997 abstract; figure 2.
Advanced Engineering Materials, 6, No. 3, (month unavailable) 2004, pp. 142-144, Arndt. Luedtke, “Thermal Management Materials for High-Performance Applications”.

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