Refractory coatings and method of producing the same

Chemistry: electrical and wave energy – Processes and products – Vacuum arc discharge coating

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C23C 1500

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active

043361170

ABSTRACT:
This invention is concerned with improving adhesion, friction and wear properties of sputtered refractory coatings on substrates of materials that form stable nitrides.
Each substrate (10) is placed directly below a titanium carbide target (16) of a commercial radiofrequency diode apparatus (14) in a vacuum chamber (26). Nitrogen is bled into the system through a nozzle (30) resulting in a small partial pressure of about 0.5% to 2.5% during the first two minutes of deposition. The flow of nitrogen is then stopped, and the sputtering ambient is reduced to pure argon through a nozzle (28) without interrupting the sputtering process.
When nitrogen is deliberately introduced during the crucial interface formation, some of the titanium at the interface reacts to form titanium nitride while the metal of the substrate also forms the nitride. These two nitrides atomically mixed together in the interfacial region (38) act to more strongly bond the growing titanium carbide coating (12) as it forms on the substrate (10).

REFERENCES:
patent: 3503787 (1970-03-01), Penose
patent: 3793175 (1974-02-01), Joly
patent: 3798145 (1974-03-01), Fournier
patent: 3912461 (1975-10-01), Wakefield
patent: 4098956 (1978-07-01), Blickensderfer
Stephen Pepper et al., Shear Strength of Metal-SiO.sub.2 Contacts, NASA TM-78838, 3/78.
J. E. Greene and M. Pestes, Adhesion of Sputter-Deposited Carbide Films to Steel Substrates, Thin Solid Films, 37 (1976), pp. 373-385.
William A. Brainard et al., "An XPS Study of the Adherence of Refractory . . . Coatings", J. Vac. Sci. Technol. 15(6), Nov./Dec. 1978, pp. 1800-1805.

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