Metal fusion bonding – Including means to apply flux or filler to work or applicator – Gaseous flux
Patent
1992-02-14
1993-03-23
Ramsey, Kenneth J.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
Gaseous flux
432 72, 423219, 4232453, 2281802, 228242, 219388, B01D 5000
Patent
active
051956748
ABSTRACT:
A reflow system for heating solders temporarily attaching electronic components to a circuit board, includes an elongated heating chamber in which a conveyor extending from an inlet to an outlet of the heating chamber, at least one first heating unit, a fan unit and an organic substance decomposition unit are disposed. The conveyor, first heater unit and fan unit are arranged to circulate gas in the heating chamber along a circulation path such that the gas is first heated by the first heater unit, then forced by the fan against the conveyor, and thereafter heated again by the first heater unit. The organic substance decomposition unit is disposed in the circulation path. The solders are heated by hot air. It is possible to heat the solder with hot nitrogen gas in which instance a nitrogen gas supply unit disposed outside the heating chamber is used to fill the heating chamber with nitrogen gas.
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Matsushita Electric - Industrial Co., Ltd.
Ramsey Kenneth J.
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