Reflow soldering to mounting pads with vent channels to avoid sk

Details Reflow soldering to mounting pads with vent channels to avoid sk Reflow soldering to mounting pads with vent channels to avoid sk

1995-09-05

1998-12-01

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29832, 174262, 174263, 22818021, H05K 334

Patent

active

058422757

ABSTRACT:
Method of surface mounting an electronic component to a bonding pad on one side of a supporting insulating board carrying a planar printed circuit thereon, the pad being connected to one or more conductors on the board by use of solder material subject to one or more gas trapping through-hole vias, comprising: (a) creating at least one vent channel below the top plane of the printed circuit and extending from a location at or closely adjacent to one of said vias to a location essentially near a periphery of solder material to be placed thereover; (b) planting a deposit of solder material between the component and pad; (c) bringing the component, solder material and pad together to form an assembly; and (d) heating the assembly to momentarily reflow the solder material in place without shifting, skewing, or tilting of the component, any trapped air in said one vias being allowed to expand and migrate away through the channel to at least the periphery of the pad.

REFERENCES:
patent: 3353139 (1967-11-01), Ribbelink
patent: 3710196 (1973-01-01), Fifield
patent: 3888639 (1975-06-01), Hastings et al.
patent: 4139881 (1979-02-01), Shimizu et al.
patent: 4979076 (1990-12-01), DiBugnara
patent: 5140745 (1992-08-01), McKenzi, Jr.
patent: 5249098 (1993-09-01), Rostoker et al.
patent: 5420377 (1995-05-01), Bresin et al.
Wannenmacher, Jr.; United States Statutory Invention Registration; "Stress Controlling Mounting Structures for Printed Circuit Boards"; Jul. 1991.

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