Metal fusion bonding – With means to juxtapose and bond plural workpieces – Including compliant cushioning medium
Patent
1996-09-20
2000-04-11
Heinrich, Samuel M.
Metal fusion bonding
With means to juxtapose and bond plural workpieces
Including compliant cushioning medium
228 447, 269 71, B23K 3704
Patent
active
060478756
ABSTRACT:
An improvement in a reflow soldering apparatus for bonding a connector element such as flexible circuitry or a pin type input/output (I/O) connector to a printed circuit board (PCB) is disclosed wherein a fixture tray included in the apparatus automatically aligns or self levels itself with the heating bars, or thermodes, of the apparatus. The fixture tray includes a body for supporting the connector/PCB assembly and cylindrical rods extending from the body. The rods are rotatably supported in corresponding grooves on the surface of the fixture tray table. As a thermode is pressed onto the connector/PCB assembly, the fixture tray rotates about its axis of rotation until the work area is aligned with the thermode. In a sandwich type soldering application including a pair of thermodes for simultaneously soldering opposite sides of a connector/PCB assembly, the fixture tray rests on an upper plate of a tray table supported by resilient means such as springs. Pressing an upper thermode onto the upper work surface of the connector/PCB assembly causes the work surface to rotate into alignment with the thermodes, and further causes the upper plate to descend until the bottom work surface of the connector/PCB assembly contacts the lower thermode prior to initiation of a reflow soldering cycle.
REFERENCES:
patent: 3574923 (1971-04-01), Cushman
patent: 3595556 (1971-07-01), Schonauer
patent: 3762060 (1973-10-01), Hardy
patent: 3764126 (1973-10-01), Arenas
patent: 3774834 (1973-11-01), Holler et al.
patent: 3783225 (1974-01-01), Filsinger
patent: 3988014 (1976-10-01), Worden
patent: 4638937 (1987-01-01), Belanger, Jr.
patent: 4875614 (1989-10-01), Cipolla et al.
patent: 4896811 (1990-01-01), Dunn et al.
patent: 5092510 (1992-03-01), Anstrom et al.
patent: 5127573 (1992-07-01), Chang et al.
patent: 5190205 (1993-03-01), Ozawa et al.
patent: 5377897 (1995-01-01), Zimmer
patent: 5617622 (1997-04-01), Anderson
patent: 5628660 (1997-05-01), Onitsuka
patent: 5637024 (1997-06-01), Goda
Hughes Technology Products Division brochure entitled "Hughes Model HTT-SLT-2000 PCMCIA Station", 1994.
Heinrich Samuel M.
Unitek Miyachi Coporation
LandOfFree
Reflow soldering self-aligning fixture does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Reflow soldering self-aligning fixture, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reflow soldering self-aligning fixture will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1170616