Reflow soldering method

Details Reflow soldering method Reflow soldering method

2005-08-30

2005-08-30

Cooke, Colleen P. (Department: 1754)

Metal fusion bonding

Process

Plural joints

C228S215000, C228S248100, C438S108000, C438S455000

Reexamination Certificate

active

06935553

ABSTRACT:
A soldering method includes exposing a solder paste including a solder powder and a flux on a member to a free radical gas and heating the solder paste to reflow the solder paste and vaporize any active components in the solder paste. Any flux residue is free of active components, so it is not necessary to perform cleaning after soldering to remove flux residue.

REFERENCES:
patent: 4919729 (1990-04-01), Elmgren et al.
patent: 4960236 (1990-10-01), Hedges et al.
patent: 5000819 (1991-03-01), Pedder et al.
patent: 5076487 (1991-12-01), Bandyopadhyay et al.
patent: 5176759 (1993-01-01), Taguchi
patent: 5409543 (1995-04-01), Panitz et al.
patent: 5433820 (1995-07-01), Sindzingre et al.
patent: 5732874 (1998-03-01), Borzym et al.
patent: 5786073 (1998-07-01), Pasch
patent: 5831828 (1998-11-01), Cutting et al.
patent: 5863355 (1999-01-01), Ohno et al.
patent: 5919317 (1999-07-01), Tanahashi et al.
patent: 6103549 (2000-08-01), Master et al.
patent: 6220501 (2001-04-01), Tadauchi et al.
patent: 6271110 (2001-08-01), Yamaguchi et al.
patent: 6319810 (2001-11-01), Ochiai et al.
patent: 6429400 (2002-08-01), Sawada et al.
patent: 6451127 (2002-09-01), Li et al.
patent: 6468363 (2002-10-01), Henderson et al.
patent: 6518163 (2003-02-01), Sakuyama et al.
patent: 6592020 (2003-07-01), Currie et al.
patent: 6623842 (2003-09-01), Uchikoba et al.
patent: 6709963 (2004-03-01), Halderman et al.
patent: 2002/0025667 (2002-02-01), Farnworth
patent: 02290693 (1990-11-01), None
patent: 11163036 (1999-06-01), None
patent: 200158259 (2001-03-01), None

Affiliated with

Also associated with

Rating

Reflow soldering method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Reflow soldering method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reflow soldering method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3498250