Reflow soldering method

Details Reflow soldering method Reflow soldering method

1998-03-27

2000-01-04

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228131, 361743, B23K 3102

Patent

active

060100613

ABSTRACT:
With the present invention, a reflow soldering method is provided for soldering a nonvertically approaching lead, which is part of a nonvertically approaching device (e.g, an edge connector), to a corresponding soldering surface (e.g., a pad on a circuit card) that includes solder. The soldering surface and solder are heated in an oven to melt the solder. While the solder is liquids, the nonvertically approaching lead is mated with the soldering surface as it is inserted into the solder. The soldering surface, solder, and nonvertically approaching lead are then cooled, and the solder solidifies to conductively mount the nonvertically approaching lead to the soldering surface.

REFERENCES:
patent: 3474521 (1969-10-01), Schwenn
patent: 3750252 (1973-08-01), Landman
patent: 5449110 (1995-09-01), Tsuji et al.

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