Gas separation: apparatus – Including inlet means for diverse gas or solid for gas... – And outlet for condensed vapors
Patent
1998-10-07
2000-09-19
Smith, Duane S.
Gas separation: apparatus
Including inlet means for diverse gas or solid for gas...
And outlet for condensed vapors
553151, 553851, 554671, 96420, 96421, B01D 4600
Patent
active
061205850
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
The present invention relates to a reflow soldering device for mounting an electronic component on a circuit substrate by soldering.
One example of conventional reflow soldering device will be explained with reference to FIG. 11.
In FIG. 11, the conventional reflow soldering device 1 includes a conveyor means 2 for transferring a circuit substrate 3 which is loaded in, a heating means 4 for preliminarily heating the transferred circuit substrate 3 and reflow heating the same, a cooling means 5 for cooling the reflow soldered circuit substrate 3, discharge pipes 6a, 6b, 6c for letting out a gas of high temperature escaped from the entrance and exit of the heating means 4 to the outside, and a discharge blower 8 mounted in the discharge pipe 6c.
Exhaust gas from the discharge pipes 6a, 6b, 6c is discharged to the outside through a duct in the factory.
However, in the above described conventional structure, as the exhaust gas passes through the duct in the factory, a vaporized component such as flux contained in the gas becomes liquid or solid, and is deposited in the duct, causing decrease in the discharging capacity; there has thus been a problem that a large amount of time has to be spent for removing such deposited material.
An object of the present invention is to provide a reflow soldering device by which the above described problems can be solved and contaminative materials such as flux generated during the reflowing process can be sufficiently removed from the exhaust gas from a reflow furnace.
DISCLOSURE OF INVENTION
To accomplish the above object, according to the first feature of the present invention, the reflow soldering device is characterized by having a conveyor means for transferring a circuit substrate, a heating means for heating the transferred circuit substrate, a cooling means for cooling the circuit substrate which has been reflow soldered by the heating means, discharge pipes and a discharge blower for discharging an exhaust gas at of high temperature, escaped from the heating means, to the outside of the device, and a flux removing means mounted in the discharge pipes for removing a vaporized component such as flux contained in the exhaust gas by cooling the exhaust gas to a temperature lower than a temperature at which the flux vaporized component in the solder becomes liquid or solid.
In the reflow soldering device according to the first feature of the present invention, since the exhaust gas high temperature, escaped from the heating means, is cooled by the flux removing means to a temperature at which the vaporized flux component in the solder becomes liquid or solid, the vaporized flux component, which starts liquefying or solidifying more or less at 100.degree. C., can be sufficiently liquefied or solidified to be removed in a short time during which the exhaust gas passes through the flux removing means.
Also, in the reflow soldering device of the first feature of the present invention, it may be constructed such that the exhaust gas at high temperature, escaped from the heating means, is transformed to the exhaust gas of low temperature, for example 70.degree. C. and below, by the flux removing means by mixing outdoor air at room temperature into the exhaust gas, by which the liquefied or solidified component such as flux is strained and removed, whereby the device can be most simplified in its construction.
Also, in the reflow soldering device of the first feature of the present invention, it may be constructed such that the exhaust gas at high temperature escaped from the heating means, is transformed into the exhaust gas at low temperature, for example 70.degree. C. and below, by the flux removing means by mixing a gas at a temperature which is lower than the room temperature into the exhaust gas, by which the liquefied or solidified component such as flux is strained and removed, whereby the amount of the gas which is mixed in can be reduced and thereby the flux removing means can be minimized in size.
Also, in the reflow soldering device of
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Chikahisa Naoichi
Inomata Akio
Masui Masuo
Nonomura Masaru
Matsushita Electric - Industrial Co., Ltd.
Smith Duane S.
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