Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Patent
1998-02-26
2000-08-01
Walberg, Teresa
Electric heating
Heating devices
Combined with container, enclosure, or support for material...
219394, 2281801, 432124, F27B 700
Patent
active
060969997
DESCRIPTION:
BRIEF SUMMARY
SUMMARY OF THE INVENTION
The invention relates to an apparatus for subjecting objects to processes, wherein the apparatus comprises:
a plurality of chambers which are each adapted to contain at least one object; and
processing devices for processing objects present in the chambers.
BACKGROUND OF THE INVENTION
Such apparatus are generally known, for example in the form of reflow soldering apparatus which are constructed in a linear configuration. In these reflow soldering apparatus of the prior art a plurality of chambers is arranged which are each adapted to subject the objects present therein to a process, in the case of a reflow soldering apparatus to a temperature treatment in order to allow the soldering process to be performed. For this purpose a determined temperature is maintained in each of the relevant chambers and the object for processing, in this case the printed circuit board, passes through the various chambers so that, as seen in time, the object progresses through a temperature profile. The reflow solder process takes place as a result of progression through the temperature profile.
Such reflow soldering apparatus of the prior art are bulky. In view of the fact that such soldering apparatus are often utilized in places where space is expensive, there is a need for reflow soldering apparatus which take up a smaller volume.
This object is achieved in that the chambers are adapted to successively perform different processes on the object present in the chamber.
BRIEF DESCRIPTION OF THE INVENTION
According to a first preferred embodiment the chambers are moveable in accordance with a closed circuit, and the processing devices are adapted to perform a process on the object which is present in a chamber present in a defined position.
As a result of the configuration of a closed circuit according to which the chambers are moveable, it becomes possible to use a smaller volume, whereby the sought after economy of space is achieved.
An exceptional economy of space is achieved when the apparatus is adapted to cause the chambers to move according to a substantially circular path.
According to another preferred embodiment the apparatus is adapted to cause the chambers to move substantially through a rectangular path.
This configuration results, albeit at the expense of a complicated drive technique, in the apparatus taking up still less space than in the case of the embodiment in which there is a circular path. It is in any case possible with a rectangular path to arrange the chambers closer to each other so that less space is required.
According to yet another embodiment the chambers are arranged fixedly and transport means are arranged for transporting the objects for processing and processed objects in and out of the chambers. This offers the possibility of still greater space-saving because the chambers can be arranged connecting directly onto each other. It is pointed out here however that the infeed and outfeed means are rather complicated so that use is preferably made of a robot.
As stated, the apparatus is adapted according to a preferred embodiment to perform a temperature treatment on objects. The heat treatments for performing with the apparatus according to the invention are not limited to reflow soldering; a synthetic resin can likewise be cured with the apparatus.
It is also however also possible for the apparatus to be adapted to perform other processes on objects for processing, for instance processing the objects with a chemical substance. An example of such a process is cleaning objects by means of a plasma, in particular at least partially metal objects, for example printed circuit boards.
Arranged in each of the chambers according to yet another preferred embodiment are heating means in for instance the form of IR light sources which are adapted to heat by means of radiation the objects for heating which are present inside the chamber.
This embodiment is of particular importance when the process to which the objects for processing must be subjected requires a large positive t
REFERENCES:
patent: 1385662 (1921-07-01), Bradley
patent: 3272933 (1966-09-01), Henderson
patent: 5101546 (1992-04-01), Otani et al.
patent: 5296680 (1994-03-01), Yamada
patent: 5462599 (1995-10-01), Kuster
patent: 5573688 (1996-11-01), Chanasyk et al.
Den Dopper Rolf Arthur
Schmits Jeroen Lambertus
Fuqua Shawntina
Soltec B.V.
Walberg Teresa
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