Reflow soldering apparatus for soldering electronic parts to cir

Details Reflow soldering apparatus for soldering electronic parts to cir Reflow soldering apparatus for soldering electronic parts to cir

1993-11-23

1995-11-21

Bradley, P. Austin

Metal fusion bonding

With control means responsive to sensed condition

Work-responsive

228 8, 228 42, 219388, B23K 3538, B23K 1012

Patent

active

054679125

ABSTRACT:
There is provided a reflow soldering apparatus for soldering electronic parts to a circuit substrate by blowing various inert hot gases of a desired density and temperature. A device for detecting whether or not a processing object is being conveyed into the apparatus is provided, so that the amount of inert gas to be supplied and the gas blowing speed are decreased when no processing object is present inside the apparatus. As a result, the amount of gas which flows out is made small, and a decrease in the temperature of the apparatus can be prevented. When the processing object is conveyed into the apparatus, the amount of supplied gas is increased so as to obtain a sufficient gas density. Thus, it is possible to prevent solder from being oxidized, and satisfactory solderability can be obtained.

REFERENCES:
patent: 5039841 (1991-08-01), Kato et al.
patent: 5163599 (1992-11-01), Mishina et al.
patent: 5296680 (1994-03-01), Yamada

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