Reflow soldering apparatus and reflow soldering method

Details Reflow soldering apparatus and reflow soldering method Reflow soldering apparatus and reflow soldering method

2005-12-06

2005-12-06

Stoner, Kiley S. (Department: 1725)

Metal fusion bonding

Process

Specific rate of varying temperature or schedule of distinct...

C228S043000, C432S128000, C432S171000

Reexamination Certificate

active

06971571

ABSTRACT:
A bath apparatus12reserves a liquid13as a heating medium and includes an input partition bath31, a first intermediate partition bath32, a heat partition bath33, a second intermediate partition bath34and a removing partition bath35that are divided by gates21through24and sequentially arranged in a direction in which a printed board assembly where components are loaded onto a printed board moves. The temperatures of liquids13-31and13-32in the input partition bath31and the first partition bath32are a preheating temperature. The temperature of a liquid13-33in the heat partition bath33is a soldering temperature. The gate21is gradually opened while the printed board assembly11is located in the first intermediate partition bath32and before the printed board assembly11is conveyed into the heat partition bath33. The liquid in the heat partition bath33is mixed with the liquid in the first intermediate partition bath32, and thus the temperature of the first intermediate partition bath32is gradually increased to the soldering temperature. The temperature of the printed board assembly11is gradually increased from the preheating temperature to the soldering temperature.

REFERENCES:
patent: 4155965 (1979-05-01), Allada
patent: 4612712 (1986-09-01), Pescatore et al.
patent: 4830263 (1989-05-01), Dexheimer
patent: 4874124 (1989-10-01), Johns et al.
patent: 5044944 (1991-09-01), Furuya et al.
patent: 5538008 (1996-07-01), Crowe
patent: 5579981 (1996-12-01), Matsumura et al.
patent: 6386422 (2002-05-01), Cheng et al.
patent: 0 217 588 (1987-04-01), None
patent: 61-82965 (1986-04-01), None
patent: 62-64475 (1987-03-01), None
patent: 63-30172 (1988-02-01), None
patent: 1-112721 (1989-05-01), None
patent: 6-21644 (1994-01-01), None
patent: 6-61640 (1994-03-01), None
patent: 6-79447 (1994-03-01), None
patent: 6-188556 (1994-07-01), None
patent: 6-320260 (1994-11-01), None
patent: 7-44824 (1995-02-01), None
patent: 7-87987 (1995-09-01), None
patent: 7-273442 (1995-10-01), None
patent: 2625918 (1997-04-01), None

Affiliated with

Also associated with

Rating

Reflow soldering apparatus and reflow soldering method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Reflow soldering apparatus and reflow soldering method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reflow soldering apparatus and reflow soldering method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3514701