Reflow soldering apparatus

Electric heating – Metal heating – For bonding with pressure

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Details

219373, 219 8512, 2281802, H05K 334, B23K 3102

Patent

active

048474657

ABSTRACT:
A reflow soldering apparatus for soldering parts which are temporarily fixed on a substrate by using cream solder. The apparatus includes a hot gas blower provided with a number of holes for blowing hot gas through the holes. The apparatus also includes a substrate moving mechanism for moving the substrate along the hot gas blower at a distance therefrom to expose the substrate to hot gas blown through the holes, thereby reflowing the cream solder.

REFERENCES:
patent: 3825994 (1974-07-01), Coleman
patent: 4574182 (1986-03-01), Pescatore et al.
patent: 4580716 (1986-04-01), Barresi et al.
patent: 4605152 (1986-08-01), Fridman
patent: 4610388 (1986-09-01), Koltuniak et al.
patent: 4771929 (1988-09-01), Bahr et al.

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