Reflow soldering apparatus

Details Reflow soldering apparatus Reflow soldering apparatus

1993-04-07

1994-10-25

Heinrich, Samuel M.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

Gaseous flux

228232, 2282341, 228 495, 432152, B23K 1012, H05K 334

Patent

active

053581660

ABSTRACT:
A reflow soldering apparatus comprises a preheating chamber and a reflow chamber, both of which are furnished with a plurality of means for circulating a hot gas being composed of a cross flow blower, a divergent nozzle, a heater, a temperature sensor, a temperature controller, and a power regulator etc. The cross-flow blowers above a conveyer are arranged in a back to back manner and the blowers beneath the conveyer are arranged in a face to face manner, and soldering is performed by impinging the hot gas upon a circuit substrate being transferred by the conveyer.
A reflow soldering apparatus having a small temperature fluctuation in the preheating chamber and the reflow chamber, high reliability in the soldering by maintaining a desired temperature profile, and preferable economy is provided.

REFERENCES:
patent: 5154338 (1992-10-01), Okuno et al.
patent: 5163599 (1992-11-01), Mishina et al.
Patent Abstracts of Japan, ABS GRP NO:M841, vol. 13, No. 274, ABS Pub Date, Jun. 23, 1989.

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