Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
1998-11-12
2001-11-20
Cuneo, Kamand (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C361S777000, C361S779000
Reexamination Certificate
active
06320139
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates generally to the field of circuit boards. More particularly, the invention relates to apparatus for selectively coupling circuit board traces.
BACKGROUND OF THE INVENTION
Circuit boards are commonly used in a variety of electronic and electrical systems to perform diverse applications. For example, computers, televisions, manufacturing facilities, industrial equipment, and household appliances all rely upon circuit boards to house electronic components and to communicate electric signals and power. Circuit boards generally include printed wire conductors or circuit board traces for communicating electric power or electric signals to and from devices and connectors on the circuit board. The circuit board traces can be arranged in diverse patterns and can be disposed on any number of layers of the circuit board.
To take advantage of economies of scale, the same circuit board is often produced for a number of different products, models, or applications. The circuit board can be configured for any of a number of uses, modes, or applications after the circuit board is manufactured. The circuit boards are typically configured by connecting or disconnecting circuit board traces via a switch or jumper wire. In this way, a circuit board, which is designed according to an unvarying pattern and produced in large quantities, can be utilized in a multitude of different applications, modes, or uses.
Configuring circuit boards with switches or jumper wires can be disadvantageous. Connecting circuit traces with jumper wires and setting switches increases the assembly cost associated with circuit boards. Additionally, jumpers (e.g., zero-ohm jumpers) and switches can be expensive, especially when inventory costs are considered. Further still, jumper wires and switches require that additional space (e.g., real estate) on the circuit board be utilized for pads or bonding areas associated with those products.
Thus, there is a need for apparatus for selectively connecting circuit board traces. Further still, there is a need for a system for forming an intentional short or bridge between two areas of exposed metal conductors (e.g., traces) on a circuit board. Further still, there is a need for a reflow solder technique that allows circuit board traces to be selectively coupled together without the use of a switch or a jumper wire.
SUMMARY OF THE INVENTION
The present invention relates to a bridge structure on a circuit board. The bridge structure includes a first conductive trace element, a second conductive trace element spaced, near the first conductive trace element, and a gap. The gap lies between the first trace element and the second trace element. A solder paste is placed upon the first element and the second element. The paste is capable of flowing when the circuit board is heated such that the paste on the first element comes into contact with the paste on the second element. The paste solidifies when the circuit board is cooled such that the solidified paste serves to connect the first element and the second element to form an electrical connection between the elements.
The present invention further relates to a circuit board including a first element and a second element separated by a gap. The first element is coupled to the second element by a method. The method includes placing a solder paste on the first element, the gap and on the second element, heating the circuit board such that the paste flows over the gap and connects the first element and the second element, and cooling the circuit board such that the paste solidifies.
The present invention even further relates to a bridge structure on a circuit board. The bridge structure includes a first element, a second element, a gap between the first element and the second element, and a means for connecting the first element and the second element via a reflow solder technique such that electricity is capable of flowing across the bridge structure.
REFERENCES:
patent: 2615768 (1952-10-01), Schluchter
patent: 3020510 (1962-02-01), Kuch
patent: 3365539 (1968-01-01), Bratsch
patent: 3528048 (1970-09-01), Kirk
patent: 3614706 (1971-10-01), Kukla
patent: 3660726 (1972-05-01), Ammon et al.
patent: 3671917 (1972-06-01), Ammon et al.
patent: 3685001 (1972-08-01), Krafthefer
patent: 3693135 (1972-09-01), Vavrick et al.
patent: 3783433 (1974-01-01), Kurtz et al.
patent: 3808578 (1974-04-01), Hansen
patent: 3905665 (1975-09-01), Lynch et al.
patent: 3973893 (1976-08-01), Camp, III
patent: 3992135 (1976-11-01), Camp, III
patent: 4025272 (1977-05-01), Camp, III
patent: 4195195 (1980-03-01), de Miranda et al.
patent: 4485166 (1984-11-01), Herwig et al.
patent: 4611746 (1986-09-01), Levine et al.
patent: 4743489 (1988-05-01), Hasegawa
patent: 4752027 (1988-06-01), Gschwend
patent: 4761325 (1988-08-01), Kurihara et al.
patent: 4861646 (1989-08-01), Barringer et al.
patent: 4867715 (1989-09-01), Roth et al.
patent: 4879156 (1989-11-01), Herron et al.
patent: 4939452 (1990-07-01), Reinholz
patent: 4968589 (1990-11-01), Perry
patent: 5004640 (1991-04-01), Nakatani et al.
patent: 5167361 (1992-12-01), Liebman et al.
patent: 5172853 (1992-12-01), Maiwald
patent: 5226964 (1993-07-01), Meuche
patent: 5288950 (1994-02-01), Ushio et al.
patent: 5308928 (1994-05-01), Parla et al.
patent: 5429100 (1995-07-01), Goto et al.
patent: 5438749 (1995-08-01), Runyon
patent: 5479319 (1995-12-01), Werther
patent: 5480483 (1996-01-01), Velie
patent: 5481435 (1996-01-01), Werther
patent: 5481436 (1996-01-01), Werther
patent: 5484962 (1996-01-01), Gamo
Byle Francis R.
McCoy Kevin M.
Zorn Todd J.
Cuneo Kamand
Gerasimow Alexander M.
Rockwell Automation Technologies Inc.
Walbrun William R.
Ziebert Joseph N.
LandOfFree
Reflow selective shorting does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Reflow selective shorting, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reflow selective shorting will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2587285