Reflow-plated member and a manufacturing method therefor

Details Reflow-plated member and a manufacturing method therefor Reflow-plated member and a manufacturing method therefor

1995-09-27

1997-03-25

Zimmerman, John

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428935, 428939, 148518, 205226, B32B 1520, C25D 550

Patent

active

056143281

ABSTRACT:
Provided is a method for manufacturing a reflow-plated member, which comprises a process for forming a plated layer of Sn or Sn alloy on the surface of a base material, at least the surface of which is formed of Cu or Cu alloy, by electroplating, and a process for running the base material at a traveling speed equivalent to 80% to 90% of the lowest traveling speed that said plated layer does not melt when the base material is continuously run for reflowing in a heating furnace at a predetermined temperature. The obtained reflow-plated member is excellent in any of properties including solderability, heat resistance, bendability, wear resistance, and corrosion resistance.

REFERENCES:
patent: 4427469 (1984-01-01), Swartz et al.
patent: 4622205 (1986-11-01), Fouts et al.
patent: 5178965 (1993-01-01), Tench et al.
patent: 5310574 (1994-05-01), Holtmann

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