Reflow of multi-layer metal bumps

Details Reflow of multi-layer metal bumps Reflow of multi-layer metal bumps

1994-01-31

1995-09-19

Wyszomierski, George

Metal treatment

Process of modifying or maintaining internal physical...

Surface melting

148525, 437183, C22C 102, C22C 502

Patent

active

054512743

ABSTRACT:
A method and apparatus for re-flow of multi-layer metal bumps. A multi layer metal bump structure is surrounded by an oxygen poor environment. The topmost layer of the metal bump structure is heated by using infrared light for a predetermined time. The infrared light has a wavelength which is selected such that the top layer is heated more than the underlying layers.

REFERENCES:
patent: 5250469 (1993-10-01), Tanaka et al.

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