Metal fusion bonding – With means to remove – compact – or shape applied flux or filler
Patent
1994-12-14
1996-10-01
Bradley, P. Austin
Metal fusion bonding
With means to remove, compact, or shape applied flux or filler
228191, 228264, B23K 1018
Patent
active
055605311
ABSTRACT:
A reflow miniovens is available for soldering/desoldering of BGA and SMT individual components on a printed circuit board (PCB). The minioven is comprised of an apparatus whose top and side oven walls are configured as a gas delivery head terminating in a detachable nozzle fitted over the component, which gas delivery head provides gas delivery and vacuum application apparatus, and with the oven bottom being the PCB and the component being soldered/desoldered being positioned directly above a preheater placed in a table on which an open frame construction board holder holding the PCB is supported, allowing placement of any surface on the PCB in direct and unobstructed view of the preheater. The nozzle is configured to direct heated gas to the component and to direct exhaust gas to a level above the PCB to avoid heating neighboring components on the PCB. A temperature sensor is located inside the minioven directly above the component and forms part of a feedback system which controls gas temperature in the oven during preset time periods. A spring-loaded vacuum pick-up member can be located over a component which is to be desoldered and which lifts the component automatically after the solder connections have reached reflow temperature.
REFERENCES:
patent: 4752025 (1988-06-01), Stach et al.
patent: 4767047 (1988-08-01), Todd et al.
patent: 4799617 (1989-01-01), Friedman
patent: 5419481 (1995-05-01), Lasto et al.
Bradley P. Austin
Knapp Jeffrey T.
O.K. Industries Inc.
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