Metal fusion bonding – Process – Plural joints
Patent
1997-04-11
2000-11-14
Heinrich, Samuel M.
Metal fusion bonding
Process
Plural joints
228230, 2282341, H05K 334, B23K 1005, B23K 1012
Patent
active
061457345
ABSTRACT:
For reflow soldering, radiant heating is applied to one surface of a printed circuit board on which electronic components are placed and onto which cream solder is supplied and at the same time hot air is blown locally and roughly perpendicular to to-be-connected points on said one surface of the printed circuit board. This reflow method permits secure soldering even if the hot air is set at a temperature not exceeding the heat resistance of the electronic components, which is possilbe because of its combination with the radiant heat. Moreover, this reflow method can permit soldering in such a manner that only the to-be-connected points are heated selectively, because the hot air is blown locally and roughly perpendicular to the points to be connected. Thus, this reflow method prevents heat damage to other sections than the to-be-connected points and ensures that the solder at the to-be-connected points is melted.
REFERENCES:
patent: 4771929 (1988-09-01), Bahr et al.
patent: 5128506 (1992-07-01), Dahne et al.
patent: 5322209 (1994-06-01), Barten et al.
patent: 5579981 (1996-12-01), Matsumura et al.
Patent abstracts of Japan, vol. 15, No. 85 (M-1087). Feb. 27, 1991 & JP 02303674 A (Matsushita Electric Ind. Co.). Dec. 17, 1990, *abstract*.
Ishimoto Kazumi
Kitagawa Tatsuaki
Matsushima Osamu
Nagai Koichi
Nemoto Seizo
Heinrich Samuel M.
Matsushita Electric - Industrial Co., Ltd.
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