Reflow Furnace

Heating – Work chamber having heating means – Having means by which work is progressed or moved mechanically

Reexamination Certificate

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Details

C219S388000, C219S394000

Reexamination Certificate

active

07442037

ABSTRACT:
In the first buffering area provided between the inlet of the furnace and the heating chamber, the ambient gas is blown to the printed circuit board from the lower side of the carrier device, while the ambient gas is sucked in the upper side of the carrier device, thus the outside air is prevented from infiltrating and the ambient gas is prevented from flowing out. Furthermore, the flux is prevented from being attached to the printed circuit board, by installing the flux dropping prevention mechanism in the suction port of the ambient gas.

REFERENCES:
patent: 6146448 (2000-11-01), Shaw et al.
patent: 6386422 (2002-05-01), Cheng et al.
patent: 6576030 (2003-06-01), Mullins
patent: 6694637 (2004-02-01), Miller et al.
patent: 6780225 (2004-08-01), Shaw et al.
patent: 2004/0063058 (2004-04-01), Orbeck et al.
patent: 2001-308512 (2001-11-01), None
patent: 2003-324272 (2003-11-01), None
patent: 2004-181483 (2004-07-01), None
U.S. Appl. No. 11/476,874, filed Jun. 29, 2006, Shibamura et al.
U.S. Appl. No. 11/476,851, filed Jun. 29, 2006, Shibamura et al.

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