Reflow compatible device package

Details Reflow compatible device package Reflow compatible device package

1989-05-22

1993-09-28

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 17VA, 220DIG27, H05K 503

Patent

active

052488489

ABSTRACT:
An electronic device package includes a portion that functions as a membrane to allow small molecules, such as gas molecules, to relatively freely traverse the housing boundary, while simultaneously substantially preventing large molecules, such as liquid molecules, from entering the confines of the housing. As a result, the package can be readily used in reflow processing without risking damage to the boundary integrity between the housing and the support surface that supports both the electronic device and the housing.

REFERENCES:
patent: 4486622 (1984-12-01), Dathe et al.
patent: 4550273 (1985-10-01), Boettcher et al.
patent: 4572210 (1986-02-01), McKinnon
patent: 4574874 (1986-03-01), Duran
patent: 4618071 (1986-10-01), Vincent
patent: 4744240 (1988-05-01), Reichelt
patent: 4921124 (1990-05-01), Stammler
patent: 4955992 (1990-09-01), Goodale et al.
patent: 4974745 (1990-12-01), Jocham
patent: 4980550 (1990-12-01), Port

Affiliated with

Also associated with

Rating

Reflow compatible device package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Reflow compatible device package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reflow compatible device package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2192473