Reflow apparatus and method

Metal fusion bonding – Process – Specific mode of heating or applying pressure

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

228 42, B23K 1012

Patent

active

057159904

ABSTRACT:
The present invention provides a reflow apparatus and method effective to make constant the internal gas flow direction in a heating section within a reflow furnace. A circulating gas path is formed in a heating unit which collects and causes the gas to flow from a sirocco fan, up the rear side of the heating unit and then down towards a circuit board moving along a transfer path at the front side of the heating unit. Moreover, a plurality of straightening plates are arranged above the transfer path of the heating unit so as to guide the hot gas, which is flowing forwardly downwardly toward the circuit board moving along the transfer path. A blow-down nozzle is provided and includes a plurality of plates aligned in rows in the transferring direction of the circuit boards. The plates have an inverse U-shaped cross section. The blow-down nozzle is arranged below the straightening plates to cause the vertical hot gas flows to flow uniformly over the whole surface of the circuit board.

REFERENCES:
patent: 4909430 (1990-03-01), Yokota
patent: 5069380 (1991-12-01), Deambrosio
patent: 5141147 (1992-08-01), Yokota
patent: 5145100 (1992-09-01), Kondo
patent: 5147083 (1992-09-01), Halstead et al.
patent: 5195674 (1993-03-01), Nishi
patent: 5356066 (1994-10-01), Yamada
Patent Abstract of Japan, vol. 017, No. 031 (M-1356), 21 Jan. 1993 & JP-A-04 253566 (Tamura Seisakusho Co., Ltd.), 9 Sep. 1992.
Patent Abstract of Japan, vol. 011, No. 380 (M-650), 11 Dec. 1987 & JP-A-62 141268 (Tamura Seisakusho Co., Ltd.), 6 Jul. 1987.
Patent Abstract of Japan, vol. 017, No. 068 (M-1365), 10 Feb. 1993 & JP-A-04 274867 (Matsushita Electric Ind. Co.), 30 Sep. 1992.
Patent Abstract of Japan, vol. 017, No.350 (M-1438), 2 Jul. 1993 & JP-A-05 050217 (Tamura Seisakusho Co., Ltd.), 2 Mar. 1993.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Reflow apparatus and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Reflow apparatus and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reflow apparatus and method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2070932

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.