Reflection mask for EUV-lithography and method for...

Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Radiation mask

Reexamination Certificate

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Reexamination Certificate

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06849365

ABSTRACT:
A reflection mask has a multilayer reflection layer for the reflection of radiated-in radiation by constructive interference of the reflected partial beams and a multilayer layer, whose periodicity effects a destructive interference of the reflected partial beams and which performs the function of an absorber. One of the two multilayer layers is patterned in accordance with a structure to be imaged.

REFERENCES:
patent: 5304437 (1994-04-01), Tennant
patent: 6641959 (2003-11-01), Yan
patent: 38 56 054 (1988-08-01), None
patent: 0 279 670 (1988-08-01), None
Bjorkholm, J. E.: “EUV Lithography—The Successor to Optical Lithography?”, Intel Technology Journal, 3rd quarter 1998, pp. 1-10.
Yan, P.-Y. et al.: “EUV Mask Patterning Approaches”, SPIE-Int. Soc. Opt. Eng., vol. 3676, Part 1-2, 1999, pp. 309-313.

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