Reduction projection aligner system

Optics: measuring and testing – By alignment in lateral direction – With registration indicia

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Details

G01B 1127

Patent

active

043803954

ABSTRACT:
In a reduction projection aligner system wherein a pattern on a reticle is formed directly on a wafer by reducing, projecting and printing it, a positioning pattern on the wafer is optically magnified and projected and then focused onto a focal plane where a slit scans the projected image. The distance from a mechanical origin provided on the supporting body of the system to the positioning pattern on the wafer is then measured on the basis of the movement of the slit, and the reticle is then relatively moved and positioned so as to coincide with the position of the wafer relative to the body of the system, thereby bringing the wafer and the reticle into coincidence.

REFERENCES:
patent: 3649121 (1972-03-01), Holtz
patent: 3941980 (1976-03-01), Okamoto et al.
patent: 3943359 (1976-03-01), Matsumoto et al.
patent: 4045141 (1977-08-01), Moriyama et al.
patent: 4115762 (1978-09-01), Akiyama
patent: 4153371 (1979-05-01), Koizumi et al.

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