Reduction of thermally induced mechanical stress in a fixing dev

Details Reduction of thermally induced mechanical stress in a fixing dev Reduction of thermally induced mechanical stress in a fixing dev

1999-08-04

2000-09-19

Chen, Sophia S.

Electrophotography

Image formation

Fixing

219216, 399328, 430124, G03G 1520

Patent

active

061224782

ABSTRACT:
A fixing device includes a compliant material positioned between a heating member and a support member. Cyclical heating of the fixing device induces differing amounts of thermal expansion in the support member and the heating member. Deformation of the compliant material reduces the thermally induced mechanical stresses that would have been experienced by the heating member had the heating member been rigidly attached to the support member. Reducing the thermally induced mechanical stresses experienced by the heating member reduces the likelihood of failure of the heating member resulting from fracturing of the heating member.

REFERENCES:
patent: 5499087 (1996-03-01), Hiraoka et al.
patent: 5499088 (1996-03-01), Menjo
patent: 5660750 (1997-08-01), Kusaka
patent: 5753361 (1998-05-01), Visser
patent: 5765085 (1998-06-01), Law et al.
patent: 5837340 (1998-11-01), Law et al.
patent: 5842085 (1998-11-01), Mitsuya
patent: 5874710 (1999-02-01), Yoshimoto et al.

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