Reduction of surface oxidation during electroplating

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly alloy coating

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C205S239000, C205S244000, C205S252000, C205S258000, C428S646000, C428S655000

Reexamination Certificate

active

06982030

ABSTRACT:
Methods of providing improved metal coatings or metal deposits on a substrate, improvements in plating solutions that are used to provide such metal deposits and articles of the metal-coated substrates. The solderability of the metal coating is enhanced by incorporating trace amounts of phosphorus in the metal coating to reduce surface oxide formation during subsequent heating and thus enhance long term solderability of the metal coating. The phosphorus is advantageously provided in the metal coating by incorporating a source of phosphorus in a solution that is used to provide the metal coating on the substrate, and the metal coating is then provided on the substrate from the solution.

REFERENCES:
patent: 4541903 (1985-09-01), Kyono et al.
patent: 4672007 (1987-06-01), Teng et al.
patent: 4767509 (1988-08-01), Gamblin et al.
patent: 4822560 (1989-04-01), Oyama et al.
patent: 4994329 (1991-02-01), Kaimasu et al.
patent: 5024900 (1991-06-01), Kuruma et al.
patent: 5486721 (1996-01-01), Herklotz et al.
patent: 6099624 (2000-08-01), Martyak
patent: 6323128 (2001-11-01), Sambucetti et al.
patent: 6518873 (2003-02-01), O'Regan et al.
patent: 6673470 (2004-01-01), Shigekuni et al.
patent: 6726827 (2004-04-01), Khaselev et al.
patent: 6730209 (2004-05-01), Abys et al.
patent: 6808614 (2004-10-01), Khaselev et al.
patent: 2004/0149588 (2004-08-01), Aiba et al.
patent: 54115787 (1979-09-01), None
patent: 404267009 (1992-09-01), None
patent: 2002180226 (2002-06-01), None
English Abstract for JP-2002180226-A (Jun. 2002).
English Abstract for JP-63313696-A (Dec. 1988).
English Abstract for JP-404267009-A (Sep. 1992).
English Abstract for JP-54115787-A (Sep. 1979).
Japanese Machine Translation of JP 2002180226, Yoichi et al, Lead-Free Tin Alloy Solder Plated Wire.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Reduction of surface oxidation during electroplating does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Reduction of surface oxidation during electroplating, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reduction of surface oxidation during electroplating will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3589091

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.